SMT贴片加工常用英文缩写与名词解释

DMS:直接金属化系统(Direct Metallization System)
DRAM：动态随机存取存贮器(Dynamic Random Memory System)
DSO：双侧引脚小外形封装(Dual Small Outline)
DTCP：双载带封装(Dual Tape carrier Package)
3D：三维(封装)，立体(封装)(Tree - Dimension (Package))
2D：二维(封装)，二维(封装)(Two-Dimension (Package))
EB：电子束(Electronic Beam)
ECL：射级耦合逻辑(Emitter - Coupled Logic)
FC：倒装片法，倒装芯片(Flip Chip)
FCB：倒装焊(Flip Chip Bonding)
FCOB：板上倒装芯片(Flip Chip On Board)
FEM：有限元法(Finite Element Method)
FP：扁平封装(Flat Package)
FPBGA：细间距 BGA(Fine Pitch Ball Grid Array)
FPD：细间距器件(Fine Pitch Device)
FPPQFP：细间距塑料 QFP(Fine Pitch Plastic Quad Flat Package)
GaAs：神化镣(Gallium Arsenic)
GQFP：带保护环的 QFP(Guard - Ring Quad Flat Package)
HDI：高密度互荏(High Density Interconnection)
HDMI：高密度多层互连(High Density Multiplayer Interconnection)
HIC：混合集成电路(Hybrid Integrated Circuit)
HTCC：高温共烧(氧化铝)陶瓷(High Temperature Co - Fired (Alumina ) Ceramic)
HTS：高温储存(试验)(High Temperature Storage)
IC：集成电路(Int^rated Circuit)
IGBT：绝缘栅双极晶体管(Insulated Gate Bipolar Transistor)
ILB:内引脚(键合)Inner - Lead Bond(ing))
[/O：输入出(Input/Output)
IVH：内部通孔(Inner Via Hole)
JLCC：J 形引牌片式载体(J - Leaded Chip Carrier)
KGD：优质芯片(Known Good Die)
LCC：无引脚片式载体(Leadless Chip Carrier)
LCCC：无引脚陶瓷片式载体(Leadless Ceramic Chip Carrier)
LCCP：有引脚片式载体封装(Lead Chip Carrier Package)
LCD：液晶显示器(Liquid Crystal Display)
LCVD：激光化学汽相淀积(Laser Chemical Vapor Deposition)
LDI:激光直接成像(Laser Direct Imaging)
LGA：焊区阵列(Land Grid Array)
LSI:大规模集成电路(Large Scale Integrated Circuit)
LOC：芯片上引线键合(Lead Over Chip)
LQFP：薄型四边引脚扁平封装(Low Profile Quad Flat Package)
LTCC：低温共烧陶瓷(Low Temperature Co- Fired Ceramic)
MBGA：金属基板焊球阵列(Metal Ball Grid Array)
MCA：多通道存取(Multiple Channel Access)
MCM：多芯片组件(Multi- Chip Module)
MCM- C:陶瓷基板多芯片组件(Muhi Chip Module with Ceramic Substrate)
MCM-D：淀积薄膜互连基板多芯片组件(Multi Chip Module with Deposited Thin Film Interconnect Substrate)
MCM-C/D：厚/W膜混合集成多芯片组件(Multi Chip Module with Thin Film Deposited on Ceramic Substrate)
MCM - L：叠层(有机)基板多芯片组件(Multi Chip Module with Laminated Substrate)
MCP：多芯片组装(Multi Chip Package)
MEFB：金属电极表面键合(Metal Electrode Face Bonding)
MELF：金属电极无引脚表面(贴装)元件(Metal Electrodes Leadless Face Components)
MEMS：微电子机械系统(Micro electro Mechanical System)
MFP：微型扁平封装(Mini Flat Package)
MLCP：多层陶瓷封装(Multi - Layer Ceramic Package)
MMIC：微波单片集成电路(Monolithic Microwave Integrated Circuit)
MOSFET：金属氧化物半导体场效应晶体管(Metal - Oxide - Silicon Field - Effected Transistor)
MPU：微处理器(Micro Processor Unit)
MSI：中规模集成电路(Medium Scale Integration)
OLB：夕卜引脚焊接(Outer Lead Bonding)
PBGA：塑封焊球阵列(Plastic Ball Grid Array)
PC：个人计算机，个人电脑(Personal Computer)
PCB：印制电路板(Printed Circuit Board)
PFP：塑料扁平封装(Plastic Flat Package)
PGA：针栅阵列(Pin Grid Array)
PI:聚酰亚胺(Polyamide)
PIH：通孔插装(Plug-In Hole)
PLCC：塑料有引脚片式载体(Plastic Leaded Chip carrier)
PTF：聚合物厚膜(Polymer Thick Film)
PQFP：塑料引脚扁平封装(Plastic Quad Flat Package)
QFJ:四边 J 形引脚扁平封装(Quad Flat J -leaded Package)
QFP：四边引脚扁平封装(Quad Flat Package)
QIP:四边直插式封装(Quad In- line Package)
RAM：随机存取存储器(Random Access Memory)
SBB:钉头凸点焊接(Stud - Bump Bonding)
SBC：焊球连接(Solder-Ball Connection)
SCIM：单芯片集成模块(Single Chip Integrated Module)
SCM：单芯片组件(Single Chip Module)
SLIM：单级集成模块(Single Level Integrated Module)
SDIP：细间距双列直插式封装(Shrinkage Dual Inline Package)
SEM：电子扫描显微镜(Sweep Electron Microscope)
SIP：单列直插封装(Single In- line Package)
SIP：系统级封装(System In a Package)
SMC：表面组装元件(Surface Mount Component)
SMD：表面组装器件(Surface Mount Device)
SMP：表面组装封装(Surface Mount Package)
SMT：表面组装技术(Surface Mount Technology)
SOC：系统级芯片(System On Chip)
SOIC：小夕卜形封装集成电路(Small Outline Integrated Circuit)
SOJ ：小外形 J 形引脚封装(Small Outline J - leaded Package)
SOP:小外形封装(Small Outline Package)
SOP：系统级封装(System On a Package)
SOT：小外形晶体管(Small Outline Transistor)
SSI:小规模集成电路(Small Scale Integration)
SSIP:小外形单列直插式封装(Small Outline Single In- line Plug Package)
SSOP：细间距小外形封装(Shrink Small Outline Package)
SPLCC：细间距塑料无引脚片式封装(Shrinkage Plastic Leadless Chip Carrier)
STRAM：自定时随机存储器(Self Timed Random Access Memory)
TAB：载带自动焊(Tape Automated Bonding)
TBGA：载带焊球阵列(Tape Ball Grid Array)
TCM：热导器件(Thermal Conduction Module)
TCP滞式载带封装、载带封装(Tape Carrier Package)
THT:通孔插装技术(Through - Hole Technology)
TO：晶体管外壳(Transistor Outline)
TPQFP：薄型塑料四边引脚扁平封装(Thin Plastic Quad Flat Package)
TSOP:薄型小外形封装(Thin Small Outline Package)
TTL：晶体管-晶体管逻辑(Transistor-Transistor Lc^ic)
UBM：凸点金属化(Metallization Under Bump)
UFPD：超细间距器件(Ultra Small Pitch Device)
USOP：超小外形封装(Ultra Small Outline Package)
USONF：无散热片的超小外形封装(Uhra Small Outline Package Non Fin) UV：紫夕卜(线，光)(Ultra Violet)
VHSIC：超高速集成电路(Very High Speed Integrated Circuit)
VLSIC：超大规模集成电路(Very Large Scale Integrated Circuit)
WB：引线键合(Wire Bonding)
WLP：圆片级封装(Wafer Level Package)
WSI：圆片规模集成(Wafer Scale Integration)

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